Advanced Packaging
The latest Advanced Packaging coverage — news, analysis, and updates from the WindowsNews.AI desk.
Maskless Electron-Beam Lithography Order Could Slash Wait Times for Future AI PC Chips
Multibeam Corp. has secured its first order from Taiwan for the MBX, a direct‑write electron‑beam lithography platform that eliminates photomasks during prototyping. The system will be installed...
Vietnam's 50,000-engineer chip plan could reshape your next Windows PC
Vietnam intends to train 50,000 university-level semiconductor engineers by 2030, a target that sits inside a newly adopted national strategy running to 2050. The plan, formalized in September 2024,...
Samsung and SK hynix Plan Four New Memory Fabs in Korea—What It Means for Your PC and AI Future
On June 29, South Korea’s government dropped a semiconductor bombshell: Samsung Electronics and SK hynix, the two largest memory-chip makers on the planet, will pursue four new fabrication plants...
Intel Stock Surges After Trump Reveals Apple Partnership for U.S. Chip Manufacturing
Intel shares soared in early trading on June 18, 2026, following a surprise announcement by President Donald Trump that Apple has agreed to collaborate with the semiconductor giant on domestic chip...